The 182 Pro is next-generation N-type TOPCon module. It is engineered to deliver ultra-high power density by using rectangular 182mm wafers, making it the top choice for large-scale Commercial & Industrial (C&I) and utility projects.

The 182 Pro is next-generation N-type TOPCon module. It is engineered to deliver ultra-high power density by using rectangular 182mm wafers, making it the top choice for large-scale Commercial & Industrial (C&I) and utility projects.
The New N-type High Power 182 Pro (part of the TOPHiKu6 and TOPBiHiKu6 series) represents the latest leap in TOPCon (Tunnel Oxide Passivated Contact) technology, specifically engineered to maximize energy density and project returns. Built on a sophisticated 182mm wafer platform, these modules utilize Super Multi-Busbar (SMBB) technology to reduce internal resistance and enhance light trapping, pushing front-side power outputs up to a massive 660W with an industry-leading module efficiency of 24.4%. The N-type cell architecture is inherently immune to Light-Induced Degradation (LID) and offers an exceptional temperature coefficient of -0.29%/°C, allowing the panels to generate up to 1% more energy in hot climates compared to standard P-type modules. This “Pro” series is further optimized for logistics and installation, featuring a high-density cell layout that increases container load capacity by 13%, effectively reducing shipping and Balance of System (BOS) costs. With a bifaciality of up to 90% in dual-glass models, a low annual degradation rate of just 0.4% over 30 years, and a robust build certified to handle 5400Pa snow loads, the 182 Pro is a high-reliability powerhouse designed to deliver the lowest possible Levelized Cost of Energy (LCOE) for both large-scale utility and commercial applications.
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